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Release notes

  • Decreased threshould of cross-detection to 40%
  • fixed outer ridge scan for top area
  • fixed briging on ridge
  • fixed ridge detection
  • Fixed unpump detection
  • changed minimal defect area to 9
  • look for ridge higher(ridge at the bottom of the die may be too narrow) during preparation
  • changed ignorance calculation to the same as in G09E_wafer
  • Center alignment
  • new recepie
  • le_g08_wafer.1590648618.txt.gz
  • Last modified: 2020/05/28 06:50
  • by superuser