Differences
This shows you the differences between two versions of the page.
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le_g08_wafer [2019/06/06 07:29] superuser |
le_g08_wafer [2021/12/15 07:16] (current) superuser |
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| ====== Release notes ====== | ====== Release notes ====== | ||
| + | ===== Version 1.1.4.4366 ===== | ||
| + | * Ridge detection change. Ridge is brighter now | ||
| + | ===== Version 1.1.3.4072 ===== | ||
| + | * increased ridge width tolerance | ||
| + | ===== Version 1.1.2.4071 ===== | ||
| + | * Adjusted unpump sections | ||
| + | ===== Version 1.1.1.4067 ===== | ||
| + | * Support for AOI2 added | ||
| + | ===== Version 1.0.6.3800 ===== | ||
| + | * Decreased threshould of cross-detection to 40% | ||
| + | ===== Version 1.0.5.3456 ===== | ||
| + | * fixed outer ridge scan for top area | ||
| + | * fixed briging on ridge | ||
| + | ===== Version 1.0.4.3444 ===== | ||
| + | * fixed ridge detection | ||
| ===== Version 1.0.3.3443 ===== | ===== Version 1.0.3.3443 ===== | ||
| * Fixed unpump detection | * Fixed unpump detection | ||
| + | * changed minimal defect area to 9 | ||
| ===== Version 1.0.2.3442 ===== | ===== Version 1.0.2.3442 ===== | ||
| * look for ridge higher(ridge at the bottom of the die may be too narrow) during preparation | * look for ridge higher(ridge at the bottom of the die may be too narrow) during preparation | ||